Insulating adhesive tape for a semiconductor chip package having a copper lead frame

摘要

An insulating tape for use in LOC (lead-on-chip) type semiconductor chip packages. With a tripartite structure in which two adhesive layers are provided to both surfaces of a base film, the insulating tape ranges, in coefficient of thermal expansion, from 16.0 to 23.5 ppm/° C. and is very useful in improving the reliability of LOC semiconductor chip packages having lead frames.