发明名称 Electronics module having power components, and a method of manufacture
摘要 A power electronics module has a metal substrate, a printed circuit card carried on one of the faces of the substrate, and components, at least some of which are power components, mounted on the card. The card also carries electrical interconnection tracks between the components themselves and with external power supply. Conductive bridges of a shape enabling each of them to extend over a power component mutually interconnect short segments of interconnection tracks, that carry power current.
申请公布号 US6452808(B2) 申请公布日期 2002.09.17
申请号 US20010757530 申请日期 2001.01.11
申请人 SAGEM SA 发明人 HOCHE JEAN
分类号 H05K1/11;H01R12/55;H01R12/57;H01R31/08;H05K1/02;H05K1/05;H05K3/22;H05K3/34;H05K3/40;H05K7/02;H05K7/04;(IPC1-7):H05K9/00 主分类号 H05K1/11
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