发明名称 |
Heat sink assembly for dissipating heat of an electronic package mounted on an electrical socket |
摘要 |
A heat sink assembly for an electrical socket of the present invention comprises a heat sink and a latching member latching with a pair of lugs on the socket. The heat sink comprises a base plate and a plurality of fins projecting upward therefrom. A receiving channel is integrally formed between the fins in the base plate for receiving the latching member. A pair of positioning tabs depends downward from a bottom surface of the base plate to tightly engage in a slit between the electric socket and a CPU mounted thereon for positioning the heat sink assembly on the CPU and keeping it from moving along the CPU. The receiving channel and the fins extend in a first direction while the tabs extend in a second direction vertical to the first direction.
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申请公布号 |
US6452800(B2) |
申请公布日期 |
2002.09.17 |
申请号 |
US20010884348 |
申请日期 |
2001.06.18 |
申请人 |
HON HAI PRECISION IND., CO., LTD. |
发明人 |
LEE CHAO-YANG;TSENG CHAO KUN;SUN CHUNG-YUNG;LO WEI-TA |
分类号 |
H01L23/40;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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