发明名称 |
Hot plate cooling method and heat processing apparatus |
摘要 |
In a heat processing apparatus for heating a wafer on a hot plate, a black plate having at least a rear face practically having a color with a JIS lightness of 0V to 4V is positioned above the hot plate. Moreover, cooling air is blown out from nozzles onto the rear face of the hot plate so that the temperature of the hot plate can be cooled rapidly. |
申请公布号 |
US6450805(B1) |
申请公布日期 |
2002.09.17 |
申请号 |
US20000634299 |
申请日期 |
2000.08.09 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
ODA TETSUYA;TANOUE MITSUHIRO;TAKEI TOSHICHIKA |
分类号 |
H01L21/3105;F27D15/02;(IPC1-7):F27D15/02 |
主分类号 |
H01L21/3105 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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