发明名称 |
Arrangement and method for using electron channeling patterns to detect substrate damage |
摘要 |
According to one aspect of the disclosure, a method for detecting a degree of substrate damage in an integrated circuit die is provided. In one example embodiment, the back side of the die is thinned and an examination region is exposed. An electron beam is used to scan the region, and backscattered electrons are detected in response. The detected backscattered electrons are used to provide an electron channeling pattern for the scanned region. The electron channeling pattern is then compared to a reference pattern and used to determine a degree of substrate damage.
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申请公布号 |
US6452176(B1) |
申请公布日期 |
2002.09.17 |
申请号 |
US19990359103 |
申请日期 |
1999.07.22 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
DAVIS BRENNAN V. |
分类号 |
H01J37/295;(IPC1-7):H01J37/30 |
主分类号 |
H01J37/295 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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