发明名称 |
Film with metal foil |
摘要 |
In a film with metal foil of the present invention, a metal foil is stuck to the surface of a resin film via an adhesive layer. The adhesive is formed by crosslinking an acrylic polymer obtained by the copolymerization of a (meth)acrylic acid ester with a carboxyl group-containing radically polymerizable monomer, with a polyfunctional compound having a functional group reactive with the carboxyl group. The film with metal foil is very useful for producing a multi-layer wiring board by the so-called transfer method. By using this film, there can be produced a multi-layer wiring board having a fine and highly dense wiring/circuit layer and having a very excellently flat surface.
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申请公布号 |
US6451441(B1) |
申请公布日期 |
2002.09.17 |
申请号 |
US20000539261 |
申请日期 |
2000.03.30 |
申请人 |
KYOCERA CORPORATION;SEKISUI CHEMICAL CORPORATION |
发明人 |
NISHIMOTO AKIHIKO;HAYASHI KATSURA;OHYAMA YASUHIKO;DANJO SHIGERU;SHIMOMURA KAZUHIRO |
分类号 |
B32B7/12;B32B15/08;H05K3/06;H05K3/20;H05K3/40;H05K3/46;(IPC1-7):B32B15/08 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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