| 发明名称 |
Process for the chemical treatment of semiconductor wafers |
| 摘要 |
A process for the chemical treatment of semiconductor wafers in the presence of HF and then in the presence of ozone, in particular for the cleaning of silicon semiconductor wafers, is such that the semiconductor wafers that are treated with the medium containing ozone are free of aqueous HF.
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| 申请公布号 |
US6451124(B1) |
申请公布日期 |
2002.09.17 |
| 申请号 |
US20010882207 |
申请日期 |
2001.06.15 |
| 申请人 |
WACKER SILTRONIC GESELLSCHAFT FUR HALBLEITERMA TERIALIEN AG |
发明人 |
BRUNNER ROLAND |
| 分类号 |
H01L21/308;H01L21/304;H01L21/306;(IPC1-7):C23G1/02 |
主分类号 |
H01L21/308 |
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