| 摘要 |
In a method of applying a ceramic layer to an under-layer having a relatively low melting temperature, in particular a synthetic resin under-layer, particles of a ceramic material are provided on such an under-layer and, by heating, a mechanical bond between ceramic particles and the under-layer is brought about. By means of a laser device, a temperature is generated, for a time of the order of or shorter than the melting time of the under-layer, which is at least effective to obtain mutual compacting and/or sintering of the ceramic particles.
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