| 发明名称 |
Conductive paste and semiconductor component having conductive bumps made from the conductive paste |
| 摘要 |
A conductive paste composition is described which comprises an alloy of tin and a flux composition. The flux composition comprises an aromatic carboxylic acid fluxing agent and a polymeric solvent.
|
| 申请公布号 |
US6451127(B1) |
申请公布日期 |
2002.09.17 |
| 申请号 |
US19990323464 |
申请日期 |
1999.06.01 |
| 申请人 |
MOTOROLA, INC. |
发明人 |
LI LI;FANG TRELIANT |
| 分类号 |
B23K35/02;B23K35/26;B23K35/36;H01L21/60;H01L23/498;H05K3/34;(IPC1-7):B23K35/363 |
主分类号 |
B23K35/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
