| 摘要 |
This invention mounts a semiconductor device having a plurality of electrodes to a substrate. A bump electrode having a pointed tail is formed on the electrode. The concave mounting pad is formed on the substrate. A sealing resin covers the substrate. And the tail of the bump electrode is buried into the sealing resin by putting the semiconductor device close to the substrate. Further, the semiconductor device is pressed to the substrate. And the sealing resin is hardened by heating.
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