| 发明名称 |
Electrically insulating crosslinked thin-film-forming organic resin composition and method for forming thin film therefrom |
| 摘要 |
An electrically insulating crosslinked thin-film-forming organic resin composition comprising (A) an electrically insulating organic resin having silicon atom-bonded hydrogen atoms or silicon atom-bonded alkenyl groups and (B) a solvent, and a method for forming a crosslinked thin film therefrom.
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| 申请公布号 |
US6451381(B2) |
申请公布日期 |
2002.09.17 |
| 申请号 |
US20010765196 |
申请日期 |
2001.01.18 |
| 申请人 |
DOW CORNING TORAY SILCONE CO., LTD. |
发明人 |
NAKAMURA TAKASHI;KOBAYASHI AKIHIKO;SAWA KIYOTAKA;MINE KATSUTOSHI |
| 分类号 |
C08J5/18;C08G77/12;C08K5/00;C08L79/08;C08L83/10;C09D183/10;G03F7/075;H01L21/312;H01L21/316;(IPC1-7):C08G77/455;B05D3/02 |
主分类号 |
C08J5/18 |
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