发明名称
摘要 PROBLEM TO BE SOLVED: To decrease the contact resistance between a semiconductor layer and an electrode by forming a contact part comprising a dot-shaped specified layer on the surface of a contact layer for contact with the electrode in the laminated structure of a nitride-based compound semiconductor. SOLUTION: On a sapphire substrate 11, an undoped GaN ground layer 12, an N-type GaN contact layer 13, an N-type AlGa current injecting layer 14, a GaN optical guide layer 15, and InGaN active layer 16, a GaN optical guide layer 17, a P-type AlGaN current injecting layer 18 and a P-type GaN contact layer 19 are sequentially laminated and formed through a buffer layer. And on the surface of this P-type GaN contact layer 19, a contact part, wherein dots 20 comprising dot-shaped Inx Ga1-x N (0<x<=1) layers are formed, is provided. Thus, the contact resistance between the semiconductor layer and the electrode 22 can be decreased.
申请公布号 JP3325479(B2) 申请公布日期 2002.09.17
申请号 JP19970016825 申请日期 1997.01.30
申请人 发明人
分类号 H01L33/06;H01L33/12;H01L33/32;H01L33/40;H01S5/00;H01S5/323;H01S5/343 主分类号 H01L33/06
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