发明名称 FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a film deposition system for superfine particles for which a plasma condition and a nozzle condition are independently controlled. SOLUTION: This film deposition system for depositing the superfine particles in aerosol on a substrate is provided with an evacuatable film deposition chamber to which gas is introduced and an evacuatable nozzle chamber connected to the film deposition chamber and equipped with a nozzle for forming the flow of the aerosol. A barrier wall is formed between the film deposition chamber and the nozzle chamber and the barrier wall is provided with an opening part capable of maintaining a pressure difference between the film deposition chamber and the nozzle chamber and making pass through the superfine particles discharged from the nozzle. A substrate holder for holding the substrate so as to face the nozzle, whose relative position can be displaced to the nozzle, is equipped inside the film deposition chamber. As a plasma generation means not obstructing the flying of the superfine particles to the substrate, a power source means for applying voltage for plasma generation to the substrate holder is provided.
申请公布号 JP2002263473(A) 申请公布日期 2002.09.17
申请号 JP20010065630 申请日期 2001.03.08
申请人 RICOH CO LTD 发明人 SATO TATSUYA
分类号 H05H1/46;B01J19/08;B01J19/12;H01J37/32;H01L21/31 主分类号 H05H1/46
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