AUTOMATIC CONTINUOUS WAFER PROCESSING SYSTEM AND METHOD FOR PROCESSING WAFER USING THE SAME

摘要

PURPOSE: An automatic continuous wafer processing system and a method for processing a wafer using the same are provided to reduce an area of processing modules in a production line by forming the processing modules with one body. CONSTITUTION: A plurality of track modules(10,20) have a track body, a plurality of processing modules for processing wafers, and a track robot for transferring the wafers to the processing modules, respectively. A wafer division tower(30) includes a tower body having division paths, an aligner fixed to an inside of the tower body, and an elevation robot for elevating the wafers from the aligner to each place corresponding to the division paths. A plurality of load lock units(40) are installed between the track modules(10,20) and the wafer division tower(30) in order to store the wafers, temporarily and separate the wafer division tower(30) from the track modules(10,20). The number of the track modules(10,20) is equal to the number of the load lock units(40).