| 摘要 |
Hydrotalcite compounds useful as additives to synthetic resins such as epoxy resins which are used as, in particular, sealant for semiconductor devices such as transister, IC, LSI and the like, which are characterized by having a composition represented by the formula (1) below: M2+_1-XAl3+_X(CH)2A2-_X/2•MH2O in which M<2+> is at least one of Mg<2+> and Zn<2+>, x is a positive number in the range of 0.2 </= x </= 0.5, A<2-> is at least one of CO3 <2-> and SO4 <2->, and m is a number in the range of 0-2, and having a uranium (U) content of not more than 10ppb, an average secondary particle size of not more than about 3 mu m and a BET specific surface area of not more than 30m<2>/g. Also claimed is a process for obtaining these hydrotalcite compounds and the hydrotalcite compounds obtained after heat treatment. |
