摘要 |
<p>PURPOSE: An image pickup model and an image pickup device are provided to prevent dust intrusion or deterioration due to humidity in the air. CONSTITUTION: The image pickup device comprises an upper substrate(101) having a convex lens(100) as an imaging unit, a lower substrate(102), a light shielding diaphragm layer(103) composed of a light shielding member formed on the upper surface of the lower substrate(102) for example by offset printing. The image pickup device further includes a semiconductor chip(104) bearing two-dimensionally pixels including photosensor elements, adhesive(105) for adhering the lower substrate(102) and the semiconductor chip(104), a planar resin portion formed around the convex lens(100). The image pickup device also includes a diaphragm aperture(200) defined by the absence of the light shielding diaphragm layer(103) on the upper surface of the lower substrate(102) and an optical element(107) formed by adhering the upper substrate(101) and the lower substrate(102).</p> |