Vehicular modular design multiple application rectifier assembly having outer lead integument

摘要

A rectifier assembly includes two substantially identical and interchangeable heat sink plates mounted parallel to each other in spaced relation. Each heat sink plate has identically positioned diode mounting holes. A plurality of rectifier diodes are mounted within the diode mounting holes. Each diode has a diode electrode. One plate is selectively negative or positive depending on the plurality of diodes mounted within the plate such that one heat sink plate is negative and the other heat sink plate is positive. The diode mounting holes not receiving diodes therein provide diode electrode clearance and ventilation.