发明名称 Electrode for plasma processes and method for manufacture and use thereof
摘要 A silicon electrode for a plasma reaction chamber wherein processing of a semiconductor substrate such as a single wafer can be carried out and a method of processing a semiconductor substrate with the electrode. The electrode is a low resistivity electrode having an electrical resistivity of less than 1 ohm-cm. The electrode can be a zero defect single crystal silicon or silicon carbide electrode such as a showerhead electrode bonded or clamped to support such as a temperature controlled plate or ring. The showerhead electrode can be in the form of a circular disk of uniform thickness and an elastomeric joint can be provided between a support ring and the electrode. The electrode can include gas outlets having 0.020 to 0.030 inch diameters.
申请公布号 US2002127853(A1) 申请公布日期 2002.09.12
申请号 US20000749916 申请日期 2000.12.29
申请人 HUBACEK JEROME S.;ELLINGBOE ALBERT R.;BENZING DAVID 发明人 HUBACEK JEROME S.;ELLINGBOE ALBERT R.;BENZING DAVID
分类号 H05H1/46;H01J37/32;H01L21/3065;(IPC1-7):H01L21/306;C23C16/00;H01L21/302;C23F1/02 主分类号 H05H1/46
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