发明名称 TAB Band und sein Herstellungsverfahren
摘要 A TAB (tape automated bonding) tape of high precision is formed by providing a metal support (10) and adhering a conductor pattern (20) to it by an electrically insulating adhesive (12). Such a tape does not deform and can be hermetically sealed with resin. A method for producing such a TAB tape includes punching required holes, such as a device hole (14) in a metal plate (10) coated with an insulating adhesive layer (12) over the area where a conductor pattern is to be formed; and forming a required conductor pattern (24) by bonding a conductor metal foil onto the adhesive layer and etching the conductor metal foil. The material cost of this TAB tape is less and the production is facilitated. <IMAGE>
申请公布号 DE69331649(T2) 申请公布日期 2002.09.12
申请号 DE1993631649T 申请日期 1993.08.03
申请人 SHINKO ELECTRIC INDUSTRIES CO., LTD. 发明人 KODANI, KOTARO;KOYANAGI, KAZUO;SATO, KIYOKAZU
分类号 H01L21/48;H01L23/495;H05K1/05;H05K1/09;H05K3/40;(IPC1-7):H01L21/48 主分类号 H01L21/48
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