| 摘要 |
PURPOSE: A sputtering apparatus is provided to prevent the uniformity of a thin film on a substrate from being decreased by preventing target material from being separated from a Rod Anode. CONSTITUTION: A sputtering apparatus comprises a target(41), a target supporting bar(43) for supporting the target(41) and a GS(Ground Shield)(45) formed around the target(41). The sputtering apparatus further includes a number of RAs(Rod Anodes)(47) having a rough surface formed across the target(41). At this point, the RAs(47) are separated from the target(41). The sputtering apparatus further includes a substrate supporting bar(49) for supporting a substrate(51) and the substrate(51) having a defined interval from the target(41) for a moving path of target material. At this point, the RAs have a number of irregularities so as to increase the surface of the RA(47).
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