Process for applying and/or inserting plastic compositions into cavities of chip cards involves passing a plastic composition conveyed from a storage vessel through a testing device to judge irregularities and removing defective components

摘要

Process for applying and/or inserting plastic compositions into cavities of chip cards involves passing a plastic composition conveyed from a storage vessel through a testing device to judge irregularities and removing defective components. Process for applying plastic compositions free from air bubbles on electrical components or supports comprises: passing a plastic composition conveyed from a storage vessel through a testing device (24) to judge irregularities; feeding the components of the composition with irregularities through a bypass valve (25) into a collecting container; and in case the testing device measures no irregularities in the composition, closing the valve and passing the composition to a removal device (23). An Independent claim is also included for a device for carrying out the process. Preferred Features: The irregularities are determined using optical arrangements or an ultrasound arrangement.