| 摘要 |
A lithography method and apparatus is provided for forming at least one semiconductor device on a wafer (12). The method comprises the step, exposing (21) said wafer to an irradiation through a reticle in an exposure tool (4), wherein said exposing (21) includes: at least one mounting step for mounting a first reticle (15) by a mounting device, at least one first exposure step (201), in which said wafer (12) is exposed to said irradiation through said predetermined first reticle (15), at least one change-over step (203) for removing said first reticle (15) and mounting a second predetermined reticle (18) by a change-over device, at least one second exposure step (201), in which said wafer (12) is exposed to said irradiation through said predetermined second reticle (18). In particular a plurality of blade holders may be provided in said exposure tool (4) for protecting a predetermined area on said wafer from a multiple exposure, each blade holder having at least one blade (19) in a frame defining a clear exposure opening of said blade holder. The blade holders may be located either on either side of said reticle (15, 18) or on both sides of said reticle (15, 18).
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