发明名称 Covering sheet, triplate line using the sheet, signal bus for computer using the sheet and covering structure of electronic circuit using the sheet
摘要 The covering sheet includes at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein, a ground conductor layer laminated on one surface of the magnetic material layer, and a plurality of via holes for passing conducting unit for grounding the ground conductor layer, or includes a laminate consisting of at least one magnetic material layer made of a resin compound having an oxide magnetic material or a metal magnetic material mixed therein and at least one dielectric layer having a permittivity lower than that of the magnetic material layer, and a ground conductor layer laminated on one surface of the laminate.
申请公布号 US2002127924(A1) 申请公布日期 2002.09.12
申请号 US20010991648 申请日期 2001.11.26
申请人 TDK CORPORATION 发明人 MIURA TARO;FUJISHIRO YOSHIKAZU
分类号 H01L23/12;H01P1/162;H01P1/215;H01P3/02;H05K1/02;H05K9/00;(IPC1-7):H01R9/22 主分类号 H01L23/12
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