| 摘要 |
The invention relates to a device for hardening an adhesive compound by thermocompression between a first and a second component (2, 3), particularly a flip chip (3) and a film (2) that is provided with strip conductors, comprising a die cylinder device (6) which is movable in an axial direction and a die head device (7) which is mounted at one end of the die cylinder device (6). Said die cylinder device (7) comprises a pressure piece (8) which is connected in a fixed manner to the die cylinder device (6) and a die head (9) which is pivotably connected thereto and is provided with a pressure surface (10) that essentially corresponds to the surface of the first component (3). A force is transmitted therewith from the die cylinder device (6) to the first component (3) via the die head device (7) in the axial direction of the die cylinder device (6). |
