| 摘要 |
A sample (180) is separated from an integrated circuit chip or a semiconductor wafer (100) for examination so that the resulting sample (180) can be moved to a location for examination by TEM, SEM or other means. A sample (180) portion of the chip or wafer (100) containing an area of interest is separated with a two cuts (140, 160) at two different angles (130, 170) by a focused ion-beam (120). Only after the sample (180) is separated is it fixed to a micromanipulator probe (190). The sample (180) is then moved by the probe (190) to the location for examination.
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