发明名称 Housing for electronic apparatus having outer wall formed by injection molding
摘要 The housing used in the electronic apparatus has an outer wall. The outer wall is formed by injecting a metal material from a plurality of gates into a molding space in a metal die. The outer wall includes a first end portion situated on an upstream end along a flowing direction of the metal material, a second end portion situated on a downstream end of the flowing direction of the metal material, and an injection portion formed on the first end portion where the plurality of gates of the metal die are situated, forming a space between the first end portion and the injection portion.
申请公布号 US2002126445(A1) 申请公布日期 2002.09.12
申请号 US20020082709 申请日期 2002.02.25
申请人 MINAGUCHI HIROYUKI;TAJIMA NOBUYASU;YOKOYAMA NAOHIRO;SUZUKI YASUYUKI 发明人 MINAGUCHI HIROYUKI;TAJIMA NOBUYASU;YOKOYAMA NAOHIRO;SUZUKI YASUYUKI
分类号 B22D21/04;B22C9/06;B22C9/08;B22C9/22;B22D17/00;B22D17/22;G06F1/16;H05K5/04;(IPC1-7):G06F1/16;B22D1/00;B21B1/46 主分类号 B22D21/04
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