发明名称 |
Method of fabricating surface-emission type light-emitting device, surface-emitting semiconductor laser, method of fabricating the same, optical module and optical transmission device |
摘要 |
A method of fabricating a surface-emission type light-emitting device which emits light in a direction perpendicular to a semiconductor substrate, includes the following steps (a) to (e). (a) A step of forming a column-shaped section by etching at least a part of a multilayer film. (b) A step of forming a first resin layer so as to cover the column-shaped section. (c) A step of forming a second resin layer by changing the solubility of the first resin layer in a liquid. (d) A step of immersing, for a specific period of time, at least the column-shaped section and the second resin layer in a liquid in which the second resin layer dissolves, thereby removing the second resin layer at least in the area formed over the column-shaped section. (e) A step of forming an insulating layer by curing the second resin layer.
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申请公布号 |
US2002127754(A1) |
申请公布日期 |
2002.09.12 |
申请号 |
US20020092777 |
申请日期 |
2002.03.08 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
KANEKO TSUYOSHI;KONDO TAKAYUKI |
分类号 |
H01L33/00;H01L33/56;H01S5/183;H01S5/20;H01S5/22;(IPC1-7):H01L21/00;H01S5/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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