发明名称 |
Semiconductor device having silicon-on-insulator structure and method of fabricating the same |
摘要 |
A semiconductor device having a silicon-on-insulator (SOI) structure is provided. The semiconductor device includes: an insulating layer; an insular silicon region having first conductive impurity ions and being formed on the insulating layer; a source region having second conductive impurity ions and being formed at an end of the insular silicon region; a drain region having second conductive impurity ions and spaced apart from the source region at the other end of the insular silicon region; an insular body region which is disposed between the source and drain regions and on which a channel is formed; a body contact region having first conductive impurity ions and being connected to the source region and the insular body region; a conductive layer formed on the source region and the body contact region; and a source electrode in contact with the body contact region on the source region.
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申请公布号 |
US2002125534(A1) |
申请公布日期 |
2002.09.12 |
申请号 |
US20010994146 |
申请日期 |
2001.11.26 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM MIN-SU;KIM KWANG-IL |
分类号 |
H01L21/28;H01L21/8238;H01L23/52;H01L27/08;H01L27/092;H01L27/12;H01L29/417;H01L29/78;H01L29/786;(IPC1-7):H01L27/01 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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