发明名称 Wafer carrier having a low tolerance build-up
摘要 A low tolerance build-up wafer carrier and method for assembling the same for supporting semiconductor wafer disks and for interfacing with processing equipment. Press-fit fasteners are used to assemble composite carriers and attach equipment interface portions to the carrier. Each press-fit fastener comprising a first fastener portion integral with a first element and a second fastener portion integral with a second element. The first and second fastener portions interferingly engaging each other when pressed together thereby connecting first and second elements without significant tolerance build-up. A further embodiment of the invention is to provide a wafer carrier having interface contact portions positioned to accept carrier contact portions, from processing equipment, through a guide plate or kinematic coupling. The interface contact portions acting to align the carrier and prevent tolerance build-up due to the flexing of the guide plate.
申请公布号 US2002125169(A1) 申请公布日期 2002.09.12
申请号 US20010835941 申请日期 2001.04.16
申请人 BORES GREGORY W.;ZABKA MICHAEL C. 发明人 BORES GREGORY W.;ZABKA MICHAEL C.
分类号 B65D85/86;H01L21/673;(IPC1-7):B65D85/00;B65D85/30;B65D85/48 主分类号 B65D85/86
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