| 摘要 |
<p>The invention provides a method for improving adhesion between a polymeric planarizing film (16) and a semiconductor chip (10) surface. The method includes the deposition of resistive, conductive and/or insulative materials (14) to semiconductor chip (10) surface to provide a semiconductor chip (10) for an ink jet printer. The chip surface is treated with a dry etch process under an oxygen atmosphere for a period of time and under conditions sufficient to activate the surface of the chip (10). A polymeric planarizing film (16) is applied to the activated surface of the semiconductor chip (10). As a result of the dry etch process, adhesion of the planarizing film (16) is increased over adhesion between the planarizing film (16) and a semiconductor surface in the absence of the dry etch treatment of the chip surface.</p> |
