ULTRA-THIN SEMICONDUCTOR PACKAGE DEVICE HAVING DIFFERENT THICKNESS OF DIE PAD AND LEADS, AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: An ultra-thin semiconductor package device having different thickness of die pad and leads, and method for manufacturing the same are provided to increase mounting density of the semiconductor package and reduce thickness of the semiconductor package. CONSTITUTION: An upper semiconductor chip(120a) and a lower semiconductor chip(120b) are adhered to both sides of a chip adhering portion(512a) of a die pad(512) by using an adhesive(122). An edge portion(512b) of the die pad(512) is thicker than the chip adhering portion(512a). The edge portion(512b) of the die pad(512) is equal to an inner lead(516a) in thickness. The thickness of the chip adhering portion(512a) corresponds to 30 to 50 percents of the thickness of the edge portion(512b). An upper portion of the package body(526) is different from a lower portion of the package body(526) in thickness. The semiconductor chips(120a,120b) are electrically with an inner lead(516a) by a reverse bonding wire. The reverse bonding wire includes a ball boned on a surface of the inner lead(516a) and a stitch bonded with an electrode pad of the semiconductor chip(120). A bonding wire(530) connected with the upper semiconductor chip(120a) is shorter than a bonding wire(532) connected with the lower semiconductor chip(120b).