| 摘要 |
<p>A chip mounting apparatus comprises an adhesive applying unit (11), a temporary pressure-bonding unit (12) and a permanent pressure-bonding unit (13). The unit (11) uses a camera (21) to detect a substrate mark of each section area of a film substrate (1) and a substrate mark of each substrate pattern in each section area. The detection results are transmitted to the unit (12). The unit (12) detects the substrate mark with a camera (45) and pressure-bonds a chip temporarily by recognizing the position of each substrate pattern on the basis of the detection results and the location data on each substrate pattern transmitted from the unit (11). Even if the film substrate (1) expands or contracts, therefore, the chip can be highly accurately mounted. Moreover, the unit (12) does not detect the substrate mark, so that the reduction in the process efficiency can be minimized.</p> |
