| 摘要 |
<p>A plastic integrated circuit package includes a lead frame having numerous leads, a die attach pad and a ground ring. In one embodiment, the plastic integrated circuit package is provided as aplastic leadless chip carrier. Slots provided between the die attach pad and the ground ring provides support and prevent delamination from the plastic molding compound and enhanced moisture-resistance, thus resulting in a highly reliable integrated circuit package, even in the face of high temperature sycles, such as solder reflows.</p> |
