发明名称 Forming tool for forming a contoured microelectronic spring mold
摘要 <p>Production process of a flat suspended micro-structure using a sacrificial layer of polymer material and component obtained thereby The process successively comprises deposition of a sacrificial layer ( 2 ) of polymer material, deposition, on at least a part of the substrate ( 1 ) and of the front face of the sacrificial layer ( 2 ), of an embedding layer ( 6 ), the thickness whereof is larger than that of the sacrificial layer ( 2 ), and planarization so that the front faces of the sacrificial layer ( 2 ) and of the embedding layer ( 6 ) form a common flat surface. A formation layer ( 3 ) of a suspended structure ( 5 ) is deposited on the front face of the common flat surface. Planarization can comprise chemical mechanical polishing and etching of the embedding layer ( 6 ). Etching of the sacrificial layer ( 2 ) can be performed by means of a mask formed on the front face of a layer of polymer material eliminated during the planarization step.</p>
申请公布号 AU2002243921(A1) 申请公布日期 2002.09.12
申请号 AU20020243921 申请日期 2002.02.06
申请人 FORMFACTOR, INC. 发明人 STUART W. WENZEL;BENJAMIN N. ELDRIDGE
分类号 G01R1/04;G01R1/067;G01R1/073;G01R3/00;H01L21/768;H01L23/48;H01L23/482;H01R13/24;H05K3/40;H05K7/10;(IPC1-7):B81C1/00 主分类号 G01R1/04
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