发明名称 TRANSFER DEVICE IN SEMICONDUCTOR FABRICATION
摘要 PURPOSE: A transfer device in a semiconductor fabrication is provided to sense stably a loading state of a wafer in a process for transferring the wafer loaded in a cassette. CONSTITUTION: A back face of a wafer(W) is seized by a fan(20) when the wafer(W) loaded on a cassette(24) is transferred. The cassette(24) is located on a stage(26). The wafer(W) is seized by the fan(20) using an air suction method. A robot arm(22) is used for driving the fan(20). The wafer(W) is transferred if the back face of the wafer(W) is adhered to the fan(20) and the fan(20) is driven by the robot arm(22). The fan(20) includes a vacuum line. The vacuum line is contacted with the back face of the wafer(W) through an inside of the fan(20). The vacuum line is connected with an external vacuum member. The vacuum line is used for transmitting a vacuous force of the vacuum member to an air suction portion. A sensing portion(30) is installed at the fan(20) in order to sense a state of the wafer.
申请公布号 KR20020071397(A) 申请公布日期 2002.09.12
申请号 KR20010011532 申请日期 2001.03.06
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 MUN, JUN YEONG
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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