发明名称 BONDING METHOD
摘要 <p>A method of bonding a first surface to a second surface using a bonding agent that is cured by light having a wavelength in a limited band of wavelengths, wherein both surfaces are substantially opaque to wavelengths of light in the band of wavelengths, the method comprising: sandwiching a layer of the bonding agent between the first and second surfaces, said layer having an edge surface that is not in contact with either the first or second surface; and illuminating at least a portion of the bonding layer edge surface with light having a wavelength in the band of wavelengths.</p>
申请公布号 WO2002070621(A2) 申请公布日期 2002.09.12
申请号 IL2002000245 申请日期 2002.03.05
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