| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe card, which quickly follows temperature rise and temperature drop, which will not generate the defect of contact when the terminal of the probe card is displaced from a contactor substrate and by which an inspection device using the probe card will not form wrong decision. SOLUTION: The probe card 40 is used to inspect an integrated circuit formed on a semiconductor wafer. The probe card 40 is composed of a ceramic substrate 41 made of a non-oxidative ceramic. The thermal conductivity κ of the ceramic substrate 41 is 10 W/m.k<κ<300 W/m.k. |
