| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer with temperature sensor in which the contact point of the temperature measuring part of a temperature sensor and its wire element can be arranged on the surface side, the accuracy of measuring temperature can be kept, and the temperature sensor is difficult to be come off against an external force such as pulling, twisting or the like when used as a wafer for measuring temperature. SOLUTION: An aperture for temperature measuring region 40 and an aperture for fixing pin 41 are formed to arrange the temperature measuring part 30a of the temperature sensor 30 on the surface side of the wafer 20. The temperature measuring part 30a of the temperature sensor 30 is inserted into the aperture for temperature measuring part 40 and fixed using an adhesive 50, and a fixing pin 42, which bridges and fixes the wire element 32 of the temperature sensor 30, is inserted into the aperture for fixing pin 41 and fixed suing the adhesive 50.
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