ADHESIVE FILM, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain an adhesive film capable of controlling a fixing power of a wafer during dicing and peelability during pickup and collectively applying an adhesive for a semiconductor element, and applying the film for the dicing process. SOLUTION: An adhesive layer for bonding the semiconductor element in which the surface on the side of a substrate is a satin-finished surface or an embossed surface having <=1/2 surface roughness (Ra) of the film thickness is formed on the thermoplastic plastic film substrate. Thereby, individual pieces can be removed from the embossed surface and the adhesive layer can be used for thermocompression bonding of the individual pieces to the substrate when the adhesive layer is attached to the back surface of the semiconductor wafer and the wafer is then changed into the individual pieces in the dicing step.