Chip protector surface-mounted fuse device

摘要

A thin film, surface-mounted fuse which comprises two material subassemblies. The first subassembly comprises a fusible link, its supporting substrate and terminal pads. The second subassembly comprises a protective, photoimageable layer which overlies the fusible link so as to provide protection from impacts and oxidation. The photoimageable layer is a low profile coating.