发明名称 |
Wafer polishing apparatus |
摘要 |
Sensors (70,72) detect a stock removal of a wafer (50) during polishing, and a CPU (74) calculates the stock removal in accordance with information from the sensors(70,72). The CPU (74) compares the actual stock removal detected by the sensors (70,72) and a model stock removal stored in RAM (84), and determines timings for dressing and replacing said polishing pad (16) in accordance with a difference between the actual stock removal and the model stock removal. The determination results are shown on a display (82). <IMAGE> <IMAGE> |
申请公布号 |
EP0890416(A3) |
申请公布日期 |
2002.09.11 |
申请号 |
EP19980112800 |
申请日期 |
1998.07.09 |
申请人 |
TOKYO SEIMITSU CO.,LTD. |
发明人 |
INABA, TAKAO;NUMOTO, MINORU;SAKAI, KENJI;SATOH, MANABU |
分类号 |
B24B37/04;B24B37/005;B24B49/02;B24B49/04;B24B49/06;H01L21/304 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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