| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein as only one inspection terminal corresponds to an external electrode formed on a rear face of a circuit board of a semiconductor device of an object to be inspected, when position shift between the external electrode and the end section of the inspection terminal is created by an error in loading accuracy of the object to be inspected, the inspection of the object to be inspected can not be executed. SOLUTION: As two inspection terminals 16 correspond to each of the external terminals 14 formed on the rear face of the circuit board 20 of the semiconductor device of the object to be inspected, the electric contact point can be achieved at the end section of at least one inspection terminal 16, thereby achieving stable inspection of the semiconductor device. |
