| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an equipment for plating, which realizes forming a plated film at high speed with a high current density, while avoiding generation of plating irregularity by using an ultrasonic wave. SOLUTION: The method includes providing electrodes 7, 7 for plating, in a plating part 5 filled with a plating solution 5a, transferring a metal strip material 2 which is a material to be plated, so as to face the electrodes 7, 7 for plating, providing several ultrasonic vibration sheets 8, 8 so as to sandwitch the metal strip material 2 in the plating part, and sending ultrasonic wave by arranging a vibration surface of at least one vibration sheet 8 out of the several ultrasonic vibration sheets 8, 8 so as not to be parallel to the metal strip material 2. Thereby, the method can form the plated film without plating irregularities at high speed, on the metal strip material 2 to be plated.
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