发明名称 |
CONTACT PROBE AND PROBE DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a contact probe and a probe device using the same wherein it has a flexibility, crack is not created on a wiring pattern even when it is bent, and it is not necessary to bend a drawing conductor section of the wiring pattern corresponding to a position of an electrode of a printed circuit. SOLUTION: There is disclosed the contact probe 20 wherein the plurality of wiring patterns 2 are formed on a surface of a film 4 and each of the tips of the wiring patterns 2 is made to be a contact pin 2a. A part of the film 4 having the wiring patterns 2 formed thereon is removed in a direction across the wiring patterns 2 and a bending section 21 is filled with a silicon rubber S which is of a flexible and insulation member. The probe device is so constituted that the contact probe 20 is held in a condition that the contact probe 20 is bent at the bending section 21 by a mechanical component.
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申请公布号 |
JP2002257896(A) |
申请公布日期 |
2002.09.11 |
申请号 |
JP20010055543 |
申请日期 |
2001.02.28 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
UEKI MITSUYOSHI;SUGIYAMA TATSUO;TACHIKAWA NOBUYOSHI;ITO KENICHI;MATSUDA ATSUSHI;YAMADA OSAMU |
分类号 |
G01R31/26;G01R1/073;H01L21/66;(IPC1-7):G01R31/26 |
主分类号 |
G01R31/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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