发明名称 BARREL PLATING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide barrel plating equipment which effectively prevents contamination of a plating liquid due to damage of a lead wire and has high productivity. SOLUTION: The barrel plating equipment comprises a barrel which is rotatably supported at both ends by support members via two support axes, a hole at the barrel side for inserting a lead wire therein, which is formed in the barrel, and a hole at the support axis side for inserting the lead wire therein, which communicates with the hole at the barrel side and is formed in the support axis. The size of an open part at the barrel side of the hole at the support axis side is to fit the lead wire. The hole on the barrel side comprises facing to the hole at the support axis side, and has a larger diameter than the open part at the barrel side of the hole at the support axis side, which prevents inflow of workpieces when the lead wire is inserted through the hole at the barrel side.
申请公布号 JP2002256500(A) 申请公布日期 2002.09.11
申请号 JP20010051495 申请日期 2001.02.27
申请人 BEITEKKU JAPAN:KK 发明人 DAIWAN TAKASHI
分类号 C25D17/20;C25D21/00;(IPC1-7):C25D17/20 主分类号 C25D17/20
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