发明名称 METHOD FOR STICKING SUBSTRATES AND DEVICE THEREFOR
摘要 PROBLEM TO BE SOLVED: To solve the problem that, in the process of sticking two substrates under keeping a prescribed gap, a positional shift occurs after sticking, because a temperature difference between the substrates occurs at the time of sticking even if they are correctly adjusted at the room temperature. SOLUTION: The method is that the upper substrate 2 and the lower substrate 1 are fitted mutually, and a positioning pins 6, 7 are fixed by considering heat expansion at the time of sticking, then they are put into a sticking furnace as they are. The temperature of this furnace is raised to a prescribed temperature to stick them, then lowered after sticking, and the stuck substrate is cooled simultaneously.
申请公布号 JP2002255592(A) 申请公布日期 2002.09.11
申请号 JP20010059596 申请日期 2001.03.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OTSUBO TATSUHIRO;MORITA MASATAKA;MATSUDA NAOKO
分类号 C03C27/06;H01J9/26;(IPC1-7):C03C27/06 主分类号 C03C27/06
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