发明名称 METHOD AND DEVICE FOR SPLITTING SUBSTRATE, AND METHOD FOR MANUFACTURING LIQUID CRYSTAL PANEL
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and a device for splitting a substrate capable of previously preventing from occurring a trouble of a laser oscillator by preventing generation of interference of laser light irradiating a surface and a rear face of the substrate, respectively. SOLUTION: The method and device for splitting the substrate, wherein both sides of a panel 15 composed of 2 substrates stuck together are irradiated with laser light L1, and L2 simultaneously are characterized in that at least either of laser light between L1, and L2 irradiating each substrate, is made incident to substrate so as to keep a prescribed angleθto a perpendicular line 7 which is orthogonal to the surface of the substrate.</p>
申请公布号 JP2002255581(A) 申请公布日期 2002.09.11
申请号 JP20010059049 申请日期 2001.03.02
申请人 SEIKO EPSON CORP 发明人 MASUDA KENJI
分类号 G02F1/13;B23K26/00;B23K26/04;B23K26/08;B23K26/40;B23K101/36;C03B33/023;C03B33/07;C03B33/09;G02F1/1333;(IPC1-7):C03B33/09;G02F1/133 主分类号 G02F1/13
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