| 摘要 |
PROBLEM TO BE SOLVED: To provide an equipment and a method of liquid treatment, which can improve uniformity of liquid treatment to be performed on a substrate to be treated. SOLUTION: This method comprises contacting the wafer W with a plating liquid by lowering a holding part 31 for holding a wafer W; heating the wafer W in the state with a resistor exothermic body 46 arranged in the holding part 31, so that the temperature of the wafer W can become gradually higher in the center than the contour parts; and then applying voltage between an anode electrode 22 and the wafer W, to plate the surface to be plated of the wafer W.
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