| 摘要 |
In a surface acoustic wave (SAW) apparatus, a substrate (30) having a SAW device (29) provided with a balun function mounted thereon is provided on a multi-layered bottom portion (32) of a package (31). Electrical wiring patterns are disposed between an upper layer (35) and a lower layer (36) of the bottom portion such that a delay line, a reactance component, or a resistance component is added to at least one of the balanced signal terminals. Balanced signal external terminals (52,53) to connect the SAW device (29) to an external device are disposed symmetrically with respect to the center of the package (31). <IMAGE> |
