发明名称 INJECTION MOLD
摘要 PROBLEM TO BE SOLVED: To provide an injection mold capable of inexpensively molding a molded product without lowering a yield while shortening a time from injection of a resin to completion of the molded product. SOLUTION: The injection mold consists of a fixed mold 2 having a sprue part 3 for injecting a resin provided to the central part thereof and a movable mold 4 provided so as to form a cavity 6 in opposed relation to the fixed mold 2 and having a projected part 5 at the central part thereof. The sprue part 3 has a sprue bush 31, which has a through-hole 34 for injecting the resin and also has a cooling groove 31a formed to the outer periphery thereof, and the die mold core 32 provided to the outer periphery of the sprue bush 31 to close the cooling groove 31a. The sprue bush 31 comprises a material having large heat conductivity like a beryllium-copper (Be-Cu) alloy and the die mold core 32 or the like comprises a material having high hardness such as stainless steel or the like as is conventional.
申请公布号 JP2002254477(A) 申请公布日期 2002.09.11
申请号 JP20010060673 申请日期 2001.03.05
申请人 SANYO ELECTRIC CO LTD 发明人 MATSUMOTO TOSHIFUMI
分类号 B29C45/27;G11B7/26;(IPC1-7):B29C45/27 主分类号 B29C45/27
代理机构 代理人
主权项
地址
您可能感兴趣的专利